Method for producing an electro-mechanical microsystem
US8324073B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2011 |
| Grant date | Dec 4, 2012 |
| Priority date | — |
| Expiry date | Mar 10, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0115
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for producing an electro-mechanical microsystem including movable mechanical parts, said method including a phase of releasing at least one movable mechanical part, wherein the releasing phase includes the following steps: formation of at least one porous zone in a first wafer of a semiconductor material; formation of at least a pattern of a material that makes at least one movable mechanical part on a front face of the first wafer and at least a partial encapsulation of the pattern in a sacrificial layer; release of the movable mechanical part through a rear face of the first wafer throughout the porous zone, using a solvent of the sacrificial layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.