Multilayer printed wiring board
US8324512B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2011 |
| Grant date | Dec 4, 2012 |
| Priority date | — |
| Expiry date | Jan 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09745
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayered printed circuit board including a substrate, a multilayered structure built thereon and having conductor circuits and interlaminar resin insulating layers in an alternate fashion, and one or more stack-via structures including via-holes stacked one another and electrically connected to the conductor circuits through the insulating layers. Each of the via-holes includes a land portion formed on a respective one of the insulating layers and a filled via structure portion filling an opening of the respective one of the insulating layers with a metal layer such that the via-holes are stacked one another immediately above the filled via structure portion of each via-hole, the via-holes include the outermost layer via-hole in the outermost layer of the insulating layers, and one or more via-holes have the land portion having the land diameter which is larger than the land diameter of the land portion of the outermost layer via-hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.