Electronic component with mechanically decoupled ball connections
US8324695B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 6, 2008 |
| Grant date | Dec 4, 2012 |
| Priority date | — |
| Expiry date | Mar 18, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3436
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component including at least one chip and/or one support, the chip configured to be transferred onto the support and linked, at a level of at least one connection site of the chip, formed by at least one portion of a layer of the chip, to at least one connection site of the support formed by at least one portion of a layer of the support, by at least one ball, the chip and/or the support including a mechanism for mechanical decoupling of the connection site of the chip and/or of the support with respect to the chip and/or to the support, which mechanism includes at least one cavity made in the layer of the chip and/or of the support, under the connection site of the chip and/or of the support, and at least one trench, made in the layer of the chip and/or of the support, communicating with the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.