Patent · US Active

Power semiconductor module assembly with heat dissipating element

US8324720B2 · kind B2 · utility

2Cited by

7References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventor

Martin Schulz · Elsdorf, DE

Key dates

Filing date	Sep 21, 2009
Grant date	Dec 4, 2012
Priority date	—
Expiry date	Jan 20, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19041
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power semiconductor module assembly is disclosed including a power semiconductor module comprising a load terminal electrically conductively joined to a contact conductor. Part of the heat materializing during operation of the power semiconductor module in the load terminal is dissipated by using a heat dissipating element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.