Process for producing doped gallium arsenide substrate wafers having low optical absorption coefficient
US8329295B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2009 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Mar 15, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2982
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process is disclosed for producing a doped gallium arsenide single crystal by melting a gallium arsenide starting material and subsequently solidifying the gallium arsenide melt, wherein the gallium arsenide melt contains an excess of gallium relative to the stoichiometric composition, and wherein it is provided for a boron concentration of at least 5×1017 cm−3 in the melt or in the obtained crystal. The thus obtained crystal is characterized by a unique combination of low dislocation density, high conductivity and yet excellent, very low optic absorption, particularly in the range of the near infrared.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.