Method and device for removing solder material deposits from a substrate
US8330076B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 10, 2008 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Jun 7, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/1476
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is positioned to overlap with a solder material deposit arranged on the substrate in such a manner that an opening edge (21) of the receiving opening is brought into abutment against the substrate in an essentially sealing manner, the solder material deposit is subjected to thermal energy and a sleeve lumen (23) that is defined by the receiving sleeve and that is disposed transverse to a longitudinal axis (30) of the receiving sleeve is subjected to an air flow (28) that is directed to an output device (29) of the receiving sleeve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.