Integrated circuit device and method for the production thereof

US8330252B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Joachim Mahler · Regensburg, DE
• Reimund Engl · Munich, DE
• Thomas Behrens · Madison, US
• Wolfgang Kuebler · Munich, DE
• Rainald Sander · Oberhaching, DE

Key dates

• Filing date: Oct 10, 2007
• Grant date: Dec 11, 2012
• Expiry date: Mar 30, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3011
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit device includes a semiconductor chip and a control chip at different supply potentials. A lead chip island includes an electrically conductive partial region and an insulation layer. The semiconductor chip is arranged on the electrically conductive partial region of the lead chip island and the control chip is cohesively fixed on the insulation layer.