Bump structure and process of manufacturing the same
US8330280B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2011 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Jun 20, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15788
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bump structure comprises a first polymer block, a second polymer block, a first groove, an under bump metallurgy layer and a connection metal layer, wherein the first polymer block and the second polymer block are individual blocks. The first polymer block and the second polymer block are located at two sides of the first groove, the first polymer block comprises a first connection slot, and the second polymer block comprises a second connection slot communicated with the first connection slot and the first groove. The under bump metallurgy layer covers the first polymer block and the second polymer block to form a second groove, a third connection slot and a fourth connection slot communicated with each other. The connection metal layer covers the under bump metallurgy layer to form a third groove, a fifth connection slot and a sixth connection slot communicated with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.