Two-chamber system and method for serial bonding and exfoliation of multiple workpieces
US8334191B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2009 |
| Grant date | Dec 18, 2012 |
| Priority date | — |
| Expiry date | Jun 20, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68771
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for treating distinct batches of workpieces to serial procedures comprises first and second multi-site structures. In each multi-site structure the sites are rotatable for alignment in turn with loading and unloading stations together constituting treatment or process stations. Workpieces of a batch are loaded onto all of the treatment sites and then simultaneously and identically treated by operation of treatment stations with which the process sites are aligned. After treatment in the first structure, workpieces of a batch are transferred from the unloading stations of the first structure to the loading stations of the second structure for further processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.