Patent · US Active

Power semiconductor module with interconnected package portions

US8338932B2 · kind B2 · utility

0Cited by

0References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Georg Borghoff · Warstein, DE
Thilo Stolze · Arnsberg, DE

Key dates

Filing date	Dec 16, 2010
Grant date	Dec 25, 2012
Priority date	—
Expiry date	Jan 14, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power semiconductor module includes a package having a first package portion and a second package portion. The side of the first package portion facing the second package portion has an anchoring element with a first recess. The second package portion includes a second recess with an indentation which receives the anchoring element. To produce a mechanically firm connection between the first package portion and the second package portion, a plug-in element is inserted in the first recess and the second recess. The plug-in element displaces the anchoring element transversely with respect to the plug-in direction, causing the anchoring element to engage the indentation so that a form-fit connection is produced between the first package portion and the second package portion. The plug-in element prevents the anchoring element from disengaging the indentation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.