Patent · US Active

Semiconductor integrated circuit

US8339150B2 · kind B2 · utility

2Cited by
6References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 29, 2009
Grant dateDec 25, 2012
Priority date—
Expiry dateFeb 23, 2031

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R31/2884
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A semiconductor integrated circuit includes a bump pad through which data is outputted, a probe test pad having a larger size than the bump pad, a first output drive unit configured to drive the bump pad at a first drivability in response to output data, a second output drive unit configured to drive the probe test pad at a second drivability higher than the first drivability in response to the output data, and a multiplexing unit configured to transfer the output data to the first output drive unit or the second output drive unit in response to a test mode signal.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.