Arrangement of radiofrequency integrated circuit and method for manufacturing thereof
US8340622B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2007 |
| Grant date | Dec 25, 2012 |
| Priority date | — |
| Expiry date | Jun 21, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B1/40
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A master radiofrequency integrated circuit (RF IC) and a slave radiofrequency integrated circuit include a master radiofrequency module and a slave radiofrequency module, respectively. Both RF ICs include a radiofrequency side contact connectable to an antenna, for receiving radiofrequency signals, via the antenna, from a wireless communications network and a baseband side contact connected to the radiofrequency module and connectable to a contact of a baseband integrated circuit, for transmitting the baseband signals from the master radiofrequency module to the baseband integrated circuit. The RF module is connected to the radiofrequency side contact, for converting the radiofrequency signals into baseband signals. The master radiofrequency module includes a slave control unit for controlling the slave radiofrequency module. The master RF IC has a slave side contact connected to the slave control unit and to the slave RF IC, for transferring a control signal or data from and/or to slave radiofrequency module when the slave radiofrequency module is connected to the contact of the baseband integrated circuit. The slave RF IC includes a master side contact connected to a control inte…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.