Substrate processing apparatus
US8343277B2 · kind B2 · utility
7Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2010 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Dec 5, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45578
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
To inhibit a diffusion of particles into a processing chamber and reduce a cost required for exchanging a gas filter. A substrate processing apparatus comprises: a processing chamber processing substrates; a gas supply part supplying processing gas into the processing chamber; wherein the gas supply part has a gas supply nozzle disposed in the processing chamber; a filter removing impurities contained in the processing gas; and a gas supply port opened in the gas supply nozzle, for supplying into the processing chamber the processing gas from which impurities are removed by the filter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.