Patent · US Active

Method of stressing a thin pattern

US8343780B2 · kind B2 · utility

1Cited by
9References
35Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 5, 2005
Grant dateJan 1, 2013
Priority date
Expiry dateFeb 26, 2028

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D30/6744
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The invention relates to a method for straining or deforming a pattern or a thin layer (24), starting from an initial component comprising the said thin layer and a prestressed layer (20), this method comprising:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.