Method of stressing a thin pattern
US8343780B2 · kind B2 · utility
1Cited by
9References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2005 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Feb 26, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6744
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for straining or deforming a pattern or a thin layer (24), starting from an initial component comprising the said thin layer and a prestressed layer (20), this method comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.