Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same
US8344268B2 · kind B2 · utility
2Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2009 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Mar 29, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic component packaging structure includes a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or solubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.