Hideyuki Tsujimura
3Patents
2h-index
7Co-inventors
33Inventor score
Filing activity: Oct 31, 2006 → May 22, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7785500B2 | Electrically conductive adhesive | Electricity | 5 | Active |
| US8344268B2 | Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same | Emerging Cross-Sectional Technologies | 2 | Active |
| US8664773B2 | Mounting structure of semiconductor package component and manufacturing method therefor | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.