Inductors having inductor axis parallel to substrate surface
US8344478B2 · kind B2 · utility
3Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2009 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Feb 27, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Inductors and methods for integrated circuits that result in inductors of a size compatible with integrated circuits, allowing the fabrication of inductors, with or without additional circuitry on a first wafer and the bonding of that wafer to a second wafer without wasting of wafer area. The inductors in the first wafer are comprised of coils formed by conductors at each surface of the first wafer coupled to conductors in holes passing through the first wafer. Various embodiments are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.