Patent · US Active

Module having at least two surfaces and at least one thermally conductive layer therebetween

US8345427B2 · kind B2 · utility

63Cited by

81References

32Claims

0Family size

Assignee

Netlist, Inc. · US

Inventors

Robert Pauley · Mission Viejo, US
Jayesh R. Bhakta · Cerritos, US
William M. Gervasi · Ladera Ranch, US
Chi-She Chen · Walnut, US
Jose Delvalle · Brooks Road, US

Key dates

Filing date	Nov 4, 2010
Grant date	Jan 1, 2013
Priority date	—
Expiry date	Jan 11, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4913
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.