Chi-She Chen
36Patents
19h-index
18Co-inventors
74Inventor score
Filing activity: Sep 5, 2003 → Jan 24, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7254036B2 | High density memory module using stacked printed circuit boards | Emerging Cross-Sectional Technologies | 176 | Expired |
| US8301833B1 | Non-volatile memory module | Physics | 147 | Active |
| US8516187B2 | Data transfer scheme for non-volatile memory module | Physics | 134 | Active |
| US7442050B1 | Circuit card with flexible connection for memory module with heat spreader | Electricity | 96 | Active |
| US7811097B1 | Circuit with flexible portion | Electricity | 94 | Active |
| US7375970B2 | High density memory module using stacked printed circuit boards | Emerging Cross-Sectional Technologies | 92 | Active |
| US8874831B2 | Flash-DRAM hybrid memory module | Emerging Cross-Sectional Technologies | 88 | Active |
| US8782350B2 | Circuit providing load isolation and noise reduction | Emerging Cross-Sectional Technologies | 88 | Active |
| US8671243B2 | Isolation switching for backup memory | Physics | 84 | Active |
| US8154901B1 | Circuit providing load isolation and noise reduction | Emerging Cross-Sectional Technologies | 84 | Active |
| US8033836B1 | Circuit with flexible portion | Electricity | 84 | Active |
| US7839645B2 | Module having at least two surfaces and at least one thermally conductive layer therebetween | Emerging Cross-Sectional Technologies | 82 | Active |
| US8677060B2 | Isolation switching for backup of registered memory | Physics | 81 | Active |
| US7630202B2 | High density module having at least two substrates and at least one thermally conductive layer therebetween | Emerging Cross-Sectional Technologies | 79 | Active |
| US8287291B1 | Circuit with flexible portion | Electricity | 78 | Active |
| US8345427B2 | Module having at least two surfaces and at least one thermally conductive layer therebetween | Emerging Cross-Sectional Technologies | 63 | Active |
| US7180165B2 | Stackable electronic assembly | Electricity | 53 | Expired |
| US8904098B2 | Redundant backup using non-volatile memory | Physics | 37 | Active |
| US8904099B2 | Isolation switching for backup memory | Physics | 21 | Active |
| US8880791B2 | Isolation switching for backup of registered memory | Physics | 18 | Active |
| US8864500B1 | Electronic module with flexible portion | Electricity | 16 | Active |
| US9158684B2 | Flash-DRAM hybrid memory module | Emerging Cross-Sectional Technologies | 16 | Active |
| US9928186B2 | Flash-DRAM hybrid memory module | Emerging Cross-Sectional Technologies | 8 | Active |
| US9921762B2 | Redundant backup using non-volatile memory | Physics | 6 | Active |
| USRE42363E1 | Stackable electronic assembly | General | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.