Method and apparatus for interfacing multiple dies with mapping for source identifier allocation
US8347258B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 16, 2011 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Mar 13, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F3/14
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package includes a die and at least one further die. The die has an interface configured to receive a transaction request from the further die via an interconnect and to transmit a response to the transaction request to said further die via the interconnect. The die also has mapping circuitry which is configured to allocate to the received transaction a local source identity information as source identity information, the local source identity information comprising one of a set of reusable local source identity information. This ensures the order of transactions tagged with a same original source identity and target and allows transactions tagged with different source identifiers to be processed out of order.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.