Polisher for chemical mechanical planarization
US8348719B2 · kind B2 · utility
1Cited by
6References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2007 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Sep 17, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments of a polisher for chemical mechanical planarization. The polisher includes a polishing pad structure containing a first reactant therein, and a second reactant in a polishing environment over the polishing pad structure. The first reactant and the second reactant react endothermically upon contact when polishing a wafer surface between the polishing pad structure and the polishing environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.