Polishing pad manufacturing method
US8348724B2 · kind B2 · utility
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18References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2008 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Dec 11, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/205
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a polishing pad prevents slurry leaks and provides a pad that can be used to provide high optical detection accuracy. The method for manufacturing a polishing pad includes forming a groove for injecting a light-transmitting region forming material on the back surface of a polishing layer; injecting the light-transmitting region forming material into the groove and curing the material to form a light-transmitting region; and buffing the front surface of the polishing layer to expose the light-transmitting region on the front surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.