Method to arrange features on a substrate to replicate features having minimal dimensional variability
US8349241B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2002 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | May 6, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2059/023
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention is directed to a method of and a mold for arranging features on a substrate to replicate the features with minimal dimensional variability. The method includes arranging features on a layer to minimize thickness variations in the layer that are attributable to density variations of the plurality of features on the layer. The features are transferred into an underlying substrate. It is believed that by forming the features so as to define a uniform fill factor in the layer, the thickness variations may be reduced, if not abrogated. To that end, one method in accordance with the present invention includes forming a flowable material on the substrate. Thereafter, a plurality of features is formed in a region of the flowable material. The plurality of features are arranged to provide a substantially uniform fill factor in the region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.