Encapsulated MEMS device and method to form the same
US8349635B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2008 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Aug 1, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/088
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An encapsulated MEMS device and a method to form an encapsulated MEMS device are described. An apparatus includes a first substrate having a silicon-germanium seal ring disposed thereon and a second substrate having a metal seal ring disposed thereon. The metal seal ring is aligned with and bonded to the silicon-germanium seal ring to provide a sealed cavity. A MEMS device is housed in the sealed cavity. A method includes forming a silicon-germanium seal ring on a first substrate and forming a metal seal ring on a second substrate. The metal seal ring is bonded to the silicon-germanium seal ring to provide a sealed cavity that houses a MEMS device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.