Layer assembly

US8349712B2 · kind B2 · utility

Assignee

• TECHNISCHE UNIVERSITÄT BERLIN · DE

Inventors

• Andre Strittmatter · Magdeburg, DE
• Andrei Schliwa · Storkow, DE
• Tim David Germann · Berlin, DE
• Udo W. Pohl · Hofheim, DE
• Vladimir Gaysler · Novosibirsk, RU
• Jan-Hindrik Schulze · Berlin, DE

Key dates

• Filing date: Mar 30, 2011
• Grant date: Jan 8, 2013
• Expiry date: May 9, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S977/773
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

The invention inter alia relates to a method of fabricating a layer assembly comprising the steps of: arranging a first layer on top of a carrier; arranging a second layer on top of the first layer; locally modifying the material of the buried first layer and providing at least one modified section in the first layer, wherein the modified material changes or induces mechanical strain in a portion of the second layer which is arranged above the at least one modified section; after locally modifying the material of the buried first layer, depositing a third material on top of the second layer, at least one characteristic of the third material being sensitive to the local mechanical strain in the second layer.