Method of sealing a semiconductor element with an epoxy resin composition
US8349989B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Jun 2, 2011 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Jun 3, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method of sealing a semiconductor element which involves applying an epoxy resin composition including an epoxy resin and a phenolic resin obtained by reacting phenol, a biphenyl compound represented by the general formula (3) and benzaldehyde to a semiconductor element and curing the composition to seal the semiconductor element:wherein X in the formula (3) is a halogen, an OH group or an OCH3 group. The molar ratio of the total of the biphenyl compound and benzaldehyde relative to the phenol is from 0.27 to 0.40, and the molar ratio of benzaldehyde/biphenyl compound is from 5/95 to 40/60.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.