Automated slice milling for viewing a feature
US8350237B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 31, 2010 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Mar 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31749
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for performing a slice and view technique with a dual beam system. The feature of interest in an image of a sample is located by machine vision, and the area to be milled and imaged in a subsequent slice and view iteration is determined through analysis of data gathered by the machine vision at least in part. A determined milling area may be represented as a bounding box around a feature, which dimensions can be changed in accordance with the analysis step. The FIB is then adjusted accordingly to slice and mill a new face in the subsequent slice and view iteration, and the SEM images the new face. Because the present invention accurately locates the feature and determines an appropriate size of area to mill and image, efficiency is increased by preventing the unnecessary milling of substrate that does not contain the feature of interest.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.