Stacked shield compartments for electronic components
US8351221B2 · kind B2 · utility
13Cited by
8References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2011 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Jul 30, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure is related to an electronic assembly in a stacked configuration. Electronic components are formed on substrates at each level of the stacked configuration. Electromagnetic shield compartments may be provided which substantially encapsulate the electronic components. Conductive vias are formed within the substrates on each level of the stacked configuration and coupled to one another so that the electromagnetic shields at each level of the stack can couple to a common node.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.