Patent · US Active

Multi-tiered integrated circuit package

US8354743B2 · kind B2 · utility

14Cited by

22References

20Claims

0Family size

Assignee

HONEYWELL INTERNATIONAL INC. · US

Inventors

Ronald J. Jensen · Bloomington, US
David Scheid · Calabasas, US

Key dates

Filing date	Jan 27, 2010
Grant date	Jan 15, 2013
Priority date	—
Expiry date	Dec 29, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit package base includes a plurality of tiers. In some examples, an integrated circuit package encloses a plurality of stacked integrated circuits that are each electrically coupled to an electrical contact located on a respective tier of the package base. The tiers of the integrated circuit package can have different elevations relative to a bottom surface of the integrated circuit package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.