Imprint method for imprinting a pattern of a mold onto a resin material of a substrate and related substrate processing method
US8361336B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2008 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Jan 13, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An imprint method for imprinting a pattern of a mold onto a resin material on a substrate. The imprint method includes a step of forming a processed area in which an imprint pattern corresponding to the pattern of the mold is formed, and an outside area formed of a periphery of the processed area, by bringing the mold into contact with the resin material formed on the substrate, so that a portion of the resin material is extruded from the processed area into the outside area, a step of forming a protection layer for protecting the processed area, and a step of removing a layer of the resin material in the outside area, while the imprint pattern formed on a layer of the resin material in the processed area, is protected by the protection layer, so as not to be removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.