Facilitating adhesion between substrate and patterned layer
US8361546B2 · kind B2 · utility
11Cited by
30References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2009 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Jul 29, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Systems and methods for adhering a substrate to a patterned layer are described. Included are in situ cleaning and conditioning of the substrate, and the application of an adhesion layer between the substrate and the patterned layer, as well as forming an intermediate layer between adhesion materials and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.