Method for alternately contacting two wafers

US8361881B2 · kind B2 · utility

Assignee

• Pac Tech—Packaging Technologies Gmbh · DE

Inventors

• Elke Zakel · Falkensee, DE
• Ghassem Azdasht · Berlin, DE

Key dates

• Filing date: Mar 29, 2011
• Grant date: Jan 29, 2013
• Expiry date: Mar 29, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/16
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method and device for alternatively contacting two wafer-like component composite arrangements, in which two component composite arrangements, provided with contact metallizations on their opposing contact surfaces, are brought into a coverage position with their contact metallizations to form contact pairs, in which position the contact metallizations to be joined together are pressed against one another, the contact metallizations being contacted by exposing the rear of one of the component composite arrangements to laser radiation, the wavelength of the laser radiation being selected as a function of the degree of absorption of the component composite arrangement, so that a transmission of the laser radiation through the component composite arrangement exposed to the laser radiation at the rear is essentially suppressed or an absorption of the laser radiation takes place essentially in the contact metallizations of one or both component composite arrangements.