Multiple-beam system for high-speed electron-beam inspection
US8362425B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2011 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Apr 27, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2446
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
One embodiment disclosed relates to a multiple-beamlet electron beam imaging apparatus for imaging a surface of a target substrate. A beam splitter lens array is configured to split the illumination beam to form a primary beamlet array, and a scanning system is configured to scan the primary beamlet array over an area of the surface of the target substrate. In addition, a detection system configured to detect individual secondary electron beamlets. Another embodiment disclosed relates to a method of imaging a surface of a target substrate using a multiple-beamlet electron beam column. Other features and embodiments are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.