Ultra high speed signal transmission/reception
US8362481B2 · kind B2 · utility
10Cited by
27References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2010 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Apr 13, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided, in combination, an integrated circuit chip, a device, and a multilayered structure mounted between the integrated circuit chip and the device. The multilayered structure has signal pathways that transfer signals between the integrated circuit chip and the device, and at least one signal pathway with a first wireless coupling element in the multilayered structure that is in communication with a second wireless coupling element in one of the integrated circuit chip, the device, and the multilayered structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.