Integrated circuit package including a thermally and electrically conductive package lid
US8362607B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2009 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Jan 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package includes a thermally and electrically conductive package lid. The package lid may be in electrical communication with an electrically conductive pad connected to a power plane, ground plane, or signal route in the integrated circuit. The electrically conductive package lid may provide an electrical connection for electrical power or electrical signals or may serve as an electrical ground. In some embodiments, the package lid may include a thermally and electrically conductive material. In other embodiments, the package lid may include an electrically insulative substrate coated on at least one surface with a layer of metal or another conductive material. The conductive layer may be electrically connected to electrical ground, a reference voltage, or a signal pay by at least one electrically conductive via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.