Microelectromechanical system microphone package structure
US8363859B2 · kind B2 · utility
3Cited by
4References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 13, 2012 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Apr 13, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R31/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microelectromechanical system microphone package structure includes a base plate and a plurality of chips is provided. The plurality of chips are disposed on the base plate, wherein an active area of each of the chips is disposed with a microelectromechanical system microphone structure, each of the active areas comprises a normal line, and the normal lines of the chips are unparallel and nonorthogonal to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.