Patent · US Active

Removing and segregating components from printed circuit boards

US8366874B2 · kind B2 · utility

5Cited by
2References
12Claims
0Family size

Assignee

Inventor

Key dates

Filing dateAug 9, 2010
Grant dateFeb 5, 2013
Priority date—
Expiry dateAug 9, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/1939
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.