Wafer level package of MEMS microphone and manufacturing method thereof
US8368153B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2010 |
| Grant date | Feb 5, 2013 |
| Priority date | — |
| Expiry date | Oct 22, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49005
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A wafer level package of micro electromechanical system (MEMS) microphone includes a substrate, a number of dielectric layers stacked on the substrate, a MEMS diaphragm, a number of supporting rings and a protective layer. The MEMS diaphragm is disposed between two adjacent dielectric layers. A first chamber is between the MEMS diaphragm and the substrate. The supporting rings are disposed in some dielectric layers and stacked with each other. An inner diameter of the lower supporting ring is greater than that of the upper supporting ring. The protective layer is disposed on the upmost supporting ring and covers the MEMS diaphragm. A second chamber is between the MEMS diaphragm and the protective layer. The protective layer defines a number of first through holes for exposing the MEMS diaphragm. The wafer level package of MEMS microphone has an advantage of low cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.