Method and apparatus for controlling position of Z-axis for wafer prober
US8368414B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 22, 2008 |
| Grant date | Feb 5, 2013 |
| Priority date | — |
| Expiry date | Aug 2, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for controlling the Z axis position of a wafer prober includes a first sensor unit including a plurality of pressure sensors distributed and installed between a Z axis support plate, for supporting a Z axis transferring unit and a Z axis base. Actuators are distributed and installed between the Z axis support plate and the Z axis base, and lift up or lower the Z axis support plate. A driving unit drives the actuators. A control module controls the driving unit to drive the actuators in response to pieces of sensed data. The control module drives the actuators when a difference between the pieces of sensed data is greater than a preset difference limit value, thus enabling the chuck plate to be maintained in a horizontal state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.