Method for manufacturing tight pitch, flip chip integrated circuit packages
US8371497B2 · kind B2 · utility
0Cited by
14References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 11, 2009 |
| Grant date | Feb 12, 2013 |
| Priority date | — |
| Expiry date | Jul 8, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip packaging method to attach a die to a package substrate, the method including dipping the die into solder paste; placing the die onto the package substrate; and reflowing the solder paste to attach the die to the package substrate. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.