Christopher J. Healy
7Patents
2h-index
11Co-inventors
44Inventor score
Filing activity: Jun 11, 2009 → Oct 27, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10410971B2 | Thermal and electromagnetic interference shielding for die embedded in package substrate | Electricity | 34 | Active |
| US10002857B2 | Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer | Electricity | 9 | Active |
| US9313881B2 | Through mold via relief gutter on molded laser package (MLP) packages | Emerging Cross-Sectional Technologies | 2 | Active |
| US8546921B2 | Hybrid multilayer substrate | Electricity | 2 | Active |
| US8753926B2 | Electronic packaging with a variable thickness mold cap | Electricity | 2 | Active |
| US11450630B2 | Coupling of integrated circuits (ICS) through a passivation-defined contact pad | Electricity | 0 | Active |
| US8371497B2 | Method for manufacturing tight pitch, flip chip integrated circuit packages | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.