Method and structure for wafer to wafer bonding in semiconductor packaging
US8377798B2 · kind B2 · utility
197Cited by
0References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2010 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | Nov 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for wafer to wafer bonding in semiconductor packaging provides for roughening the bonding surfaces in one embodiment. Also provided is a method for passivating the bonding surfaces with a lower melting point material that becomes forced away from the bonding interface during bonding. Also provided is a method for forming an eutectic at the bonding interface to reduce the impact of any native oxide formation at the bonding interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.