Inventor · Zhubei City, TW

Jung-Huei Peng

99Patents
10h-index
56Co-inventors
77Inventor score

Filing activity: Dec 31, 2008 → Jul 25, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9394161B2 MEMS and CMOS integration with low-temperature bonding Electricity 202 Active
US8377798B2 Method and structure for wafer to wafer bonding in semiconductor packaging Electricity 197 Active
US9181083B2 MEMS devices and methods of forming the same Electricity 50 Active
US9233839B2 MEMS device and method of forming the same Performing Operations; Transporting 50 Active
US9238581B2 Triple-axis MEMS accelerometer Physics 49 Active
US9138994B2 MEMS devices and methods of fabrication thereof Performing Operations; Transporting 48 Active
US8900905B1 MEMS device and method of forming the same Electricity 20 Active
US9834435B1 Structure and formation method of semiconductor device structure Performing Operations; Transporting 14 Active
US8580594B2 Method of fabricating a semiconductor device having recessed bonding site Electricity 12 Active
US8905293B2 Self-removal anti-stiction coating for bonding process Emerging Cross-Sectional Technologies 12 Active
US9695039B1 Multi-pressure MEMS package Performing Operations; Transporting 10 Active
US9643838B1 Semiconductor device and package and manufacturing method thereof Performing Operations; Transporting 10 Active
US8647962B2 Wafer level packaging bond Electricity 10 Active
US8941152B1 Semiconductor device Electricity 8 Active
US9114396B2 Method of making flowcell with micro-fluid structure Emerging Cross-Sectional Technologies 7 Active
US9352315B2 Method to produce chemical pattern in micro-fluidic structure Performing Operations; Transporting 7 Active
US9656260B2 Method to produce chemical pattern in micro-fluidic structure Performing Operations; Transporting 7 Active
US9919914B2 MEMS devices including MEMS dies and connectors thereto Electricity 6 Active
US8841201B2 Systems and methods for post-bonding wafer edge seal Electricity 6 Active
US9054121B2 MEMS structures and methods for forming the same Performing Operations; Transporting 5 Active
US10486153B2 Method to produce chemical pattern in micro-fluidic structure Performing Operations; Transporting 5 Active
US9938134B2 Getter electrode to improve vacuum level in a microelectromechanical systems (MEMS) device Performing Operations; Transporting 4 Active
US9352956B2 MEMS devices and methods for forming same Electricity 4 Active
US8455999B2 Method for reducing chip warpage Electricity 4 Active
US8609466B2 Cap and substrate electrical connection at wafer level Performing Operations; Transporting 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.