Patent · US Active

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

US8378469B2 · kind B2 · utility

2Cited by

1References

18Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Brian P. Gaucher · Brookfield, US
Duixian Liu · Yorktown Heights, US
Ullrich R. Pfeiffer · Wolfsburg, DE
Thomas Zwick · Leutkirch im Allgäu, DE

Key dates

Filing date	Jul 30, 2007
Grant date	Feb 19, 2013
Priority date	—
Expiry date	Dec 19, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30111
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Apparatus and methods are provided for integrally packaging antennas with semiconductor IC (integrated circuit) chips to provide highly-integrated and high-performance radio/wireless communications systems for millimeter wave applications including, e.g., voice communication, data communication, and radar applications. For example, wireless communication modules are constructed with IC chips having receiver/transmitter/transceiver integrated circuits and planar antennas that are integrally constructed from BEOL (back end of line) metallization structures of the IC chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.