Thermal compress bonding
US8381965B2 · kind B2 · utility
23Cited by
58References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2010 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Jul 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.