Methods and systems for semiconductor structure processing using multiple laser beam spots
US8383982B2 · kind B2 · utility
10Cited by
60References
5Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 30, 2007 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Oct 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and systems selectively irradiate structures on or within a semiconductor substrate using multiple laser beams. The structures may be laser-severable conductive links, and the purpose of the irradiation may be to sever selected links.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.