Patent · US Active

Package including wires contacting lead frame edge

US8384228B1 · kind B1 · utility

2Cited by

23References

13Claims

0Family size

Assignee

TriQuint Semiconductor, Inc. · US

Inventors

Howard D. Bartlow · Sunnyvale, US
William McCalpin · Sunnyvale, US
Binh K. Le · Longmont, US

Key dates

Filing date	Apr 29, 2009
Grant date	Feb 26, 2013
Priority date	—
Expiry date	Aug 8, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of a microelectronic package are generally described herein. A microelectronic package may include a lead frame including a major surface, and a die having including a bond pad. A wire may electrically couple a location of the major surface of the lead frame with the bond pad of the die, the wire being situated such that the wire is substantially unbent from the location of the major surface to an edge of the lead frame.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.