Integrated circuit package component and ball grid array simulation model
US8386229B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2009 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Oct 25, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2113/18
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A simulation model is provided for flip-chip BGAs to help engineers determine the effects of IC package components. The simulation model includes a bump model, a package planes model, a package bypass capacitor model, a ball model and a PCB model. The simulation model in particular includes resistors, inductors, capacitors and transmission lines to simulate the electrical interaction between signal conductors, power/ground planes, vias and balls that exist in a flip-chip ball grid array (BGA) package. The simulation model helps engineers understand actual physical effects of flip-chip and IC package interactions, as well as the impact of the effects of power supply droop, ground bounce and crosstalk between adjacent signals, not only on the IC package level, but at the computer system level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.