Method and apparatus to design an interconnection device in a multi-layer shielding mesh
US8386979B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2009 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Jul 28, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods and apparatuses to design an Integrated Circuit (IC) with a shielding of wires. In at least one embodiment, a shielding mesh of at least two reference voltages (e.g., power and ground) is used to reduce both the capacitive coupling and the inductive coupling in routed signal wires in IC chips. In some embodiments, a type of shielding mesh (e.g., a shielding mesh with a window surrounded by a power ring, or a window with a parser set of shielding wires) is selected to make more routing area available in locally congested areas. In other embodiments, the shielding mesh is used to create or add bypass capacitance. Other embodiments are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.