Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor
US8388792B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2008 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Dec 13, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a nonstick material for use during removal of a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least on further, substantially planar material layer (9). According to the invention, the nonstick material (8) has a different polarity than the adjoining, substantially planar material layers (2, 9). The invention also relates to a method for removing a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least one further, substantially planar material layer (9), to a multilayer structure which consists of at least two substantially planar material layers (2, 9) to be interconnected, and to a use of the same, especially in a multilayer printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.